LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

A laser processing method for scanning over a first member in a first direction while irradiating the first member with a laser beam emitted from an oscillator, and joining the first member and a second member adjacent to the first member by a molten portion, the laser processing method including th...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAI, IZURU, FUJIWARA, KAZUKI, FUNAMI, KOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing method for scanning over a first member in a first direction while irradiating the first member with a laser beam emitted from an oscillator, and joining the first member and a second member adjacent to the first member by a molten portion, the laser processing method including the steps of: in each of a first measurement region and a second measurement region different from the first measurement region, measuring an intensity of a welding light including any one of a heat radiation light radiated from at least one of the first member and the second member by irradiation with the laser beam, a plasma light, and a reflected light; and evaluating a processing state based on the intensity of the welding light measured in each of the first measurement region and the second measurement region, in which the first measurement region and the second measurement region are aligned in a second direction intersecting the first direction.