SEMICONDUCTOR STRUCTURES FOR GALVANIC ISOLATION

The present disclosure generally relates to semiconductor structures for capacitive isolation, and structures incorporating the same. More particularly, the present disclosure relates to capacitive isolation structures for high voltage applications. The present disclosure also relates to methods of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MUN, BONG WOONG, KOO, JEOUNG MO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure generally relates to semiconductor structures for capacitive isolation, and structures incorporating the same. More particularly, the present disclosure relates to capacitive isolation structures for high voltage applications. The present disclosure also relates to methods of forming structures for capacitive isolation and the structures incorporating the same. The disclosed semiconductor structures may enable a smaller device footprint and reduced dimensions of components on an IC chip, whilst ensuring galvanic isolation between circuits.