SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

A semiconductor device includes: a substrate; a first semiconductor chip; a first adhesive layer; a second semiconductor chip; a second adhesive layer; and a spacer. The substrate has a first surface. The first semiconductor chip is provided above the first surface. The first adhesive layer is provided on a lower surface, which is opposed to the substrate, of the first semiconductor chip and contains a plurality of types of resins different in molecular weight. The second semiconductor chip is provided between the substrate and the first adhesive layer. The second adhesive layer covers surroundings of the second semiconductor chip in a view from a normal direction of a first surface, and contains at least one type of the resin lower in molecular weight than the other resins among the plurality of types of resins contained in the first adhesive layer. The spacer covers surroundings of the second adhesive layer in the view from the normal direction of the first surface.