ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES

An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for meas...

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Hauptverfasser: Tarabulski, Matthew E, Wasserman, Matthew B, Eder, James E, Schmidt-Lange, Michael P
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Tarabulski, Matthew E
Wasserman, Matthew B
Eder, James E
Schmidt-Lange, Michael P
description An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022384384A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022384384A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022384384A13</originalsourceid><addsrcrecordid>eNqNizELwjAQRrM4iPofDlwVNHVwjZerCZg7aZLJoRSJk2ih_n-sIM7CB-8N75uqC50IUyPsEVDCWZg4wUHYej5CMOg8U1yBYQuBkhMbQepRTczNJzFgfUyGkUAYYkb3e83V5Nbdh7L4cqaWNSV069I_2zL03bU8yqvNUW-0rva7cWZb_Ve9AR1kMpk</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES</title><source>esp@cenet</source><creator>Tarabulski, Matthew E ; Wasserman, Matthew B ; Eder, James E ; Schmidt-Lange, Michael P</creator><creatorcontrib>Tarabulski, Matthew E ; Wasserman, Matthew B ; Eder, James E ; Schmidt-Lange, Michael P</creatorcontrib><description>An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221201&amp;DB=EPODOC&amp;CC=US&amp;NR=2022384384A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20221201&amp;DB=EPODOC&amp;CC=US&amp;NR=2022384384A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tarabulski, Matthew E</creatorcontrib><creatorcontrib>Wasserman, Matthew B</creatorcontrib><creatorcontrib>Eder, James E</creatorcontrib><creatorcontrib>Schmidt-Lange, Michael P</creatorcontrib><title>ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES</title><description>An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizELwjAQRrM4iPofDlwVNHVwjZerCZg7aZLJoRSJk2ih_n-sIM7CB-8N75uqC50IUyPsEVDCWZg4wUHYej5CMOg8U1yBYQuBkhMbQepRTczNJzFgfUyGkUAYYkb3e83V5Nbdh7L4cqaWNSV069I_2zL03bU8yqvNUW-0rva7cWZb_Ve9AR1kMpk</recordid><startdate>20221201</startdate><enddate>20221201</enddate><creator>Tarabulski, Matthew E</creator><creator>Wasserman, Matthew B</creator><creator>Eder, James E</creator><creator>Schmidt-Lange, Michael P</creator><scope>EVB</scope></search><sort><creationdate>20221201</creationdate><title>ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES</title><author>Tarabulski, Matthew E ; Wasserman, Matthew B ; Eder, James E ; Schmidt-Lange, Michael P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022384384A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Tarabulski, Matthew E</creatorcontrib><creatorcontrib>Wasserman, Matthew B</creatorcontrib><creatorcontrib>Eder, James E</creatorcontrib><creatorcontrib>Schmidt-Lange, Michael P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tarabulski, Matthew E</au><au>Wasserman, Matthew B</au><au>Eder, James E</au><au>Schmidt-Lange, Michael P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES</title><date>2022-12-01</date><risdate>2022</risdate><abstract>An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T10%3A46%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tarabulski,%20Matthew%20E&rft.date=2022-12-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022384384A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true