ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES

ELECTRONIC COMPONENT BONDING MACHINES, AND METHODS OF MEASURING A DISTANCE ON SUCH MACHINES

An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for meas...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tarabulski, Matthew E, Wasserman, Matthew B, Eder, James E, Schmidt-Lange, Michael P
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An electronic component bonding machine is provided. The electronic component bonding machine includes: a support structure for supporting a substrate; a bond head assembly for holding an electronic component, and for bonding the electronic component to the substrate; and a measuring system for measuring a distance between (i) an upper target on the electronic component bonding machine and (ii) a lower target on the electronic component bonding machine, the upper target including at least one of a portion of the bond head assembly and the electronic component, the lower target including at least one of a portion of the support structure and the substrate.