BOARD PROCESSING EQUIPMENT AND RECOVERY PROCESSING METHOD

A substrate processing apparatus includes a chamber, a plurality of devices, and a controller. The chamber is subjected to substrate processing. The plurality of devices execute operations related to substrate processing. The controller controls the operations of the plurality of devices. Further, t...

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Bibliographische Detailangaben
1. Verfasser:	KATONO, Hiroki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A substrate processing apparatus includes a chamber, a plurality of devices, and a controller. The chamber is subjected to substrate processing. The plurality of devices execute operations related to substrate processing. The controller controls the operations of the plurality of devices. Further, the controller determines whether or not an error has occurred during performing the substrate processing in a chamber, and causes the plurality of devices to automatically execute a recovery operation corresponding to the content of the error that has occurred when the controller determines that the error has occurred and has suspended the substrate processing.