HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE

The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Flemming, Jeb H
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.