ANTENNA PACKAGE

A package includes an upper level mounted to a lower level. The upper level includes a stack formed by insulating layers and conductive elements and includes a first conductive track of an antenna. A plastic element rests on the stack. A first cavity is defined in the plastic element. A second conductive track of the antenna is located on a wall of the plastic element (for example, in or adjacent to the first cavity). A second cavity is also defined in the plastic element surrounding the first cavity. A third conductive track of the antenna is located on a wall of the plastic element (for example, in the second cavity). A third cavity is delimited between the upper and lower levels and an integrated circuit chip is mounted within the third cavity and electrically connected to the antenna.