SEMICONDUCTOR DEVICE AND MODULE

A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrod...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAGAWA, Takeshi, MATSUBARA, Hiroshi, HARADA, Masatomi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device is provided that includes a substrate 10 with first and second opposing main surfaces, a circuit layer disposed on the first main surface, and a first resin body on a surface of the circuit layer opposite from the substrate. The circuit layer includes first and second electrode layers on a side of the semiconductor substrate, a dielectric layer disposed between the electrode layers, a first outer electrode electrically connected to the first electrode layer and extended to the surface of the circuit layer, and a second outer electrode electrically connected to the second electrode layer and extended to the surface of the circuit layer. The first resin body is between the first and second outer electrodes in a plan view, and in sectional view, a tip end of the first resin body is positioned higher than tip ends of the first and second outer electrodes.