METHOD OF MANUFACTURING COLLECTIVE SUBSTRATE AND COLLECTIVE SUBSTRATE

A method of manufacturing a collective substrate that includes: forming at least one first mark in or on a first main surface of a first substrate; joining the first main surface of the first substrate and a first main surface of a second substrate to each other; forming an opening in the second sub...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAMOTO, Taku, FUKUMITSU, Masakazu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A method of manufacturing a collective substrate that includes: forming at least one first mark in or on a first main surface of a first substrate; joining the first main surface of the first substrate and a first main surface of a second substrate to each other; forming an opening in the second substrate such that the first mark is exposed therein; and forming a device portion in or on a second main surface of the second substrate while using the first mark as a reference.