PRINTED CIRCUIT BOARD

The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surfac...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KIM, Yong Hoon, LEE, Seung Eun, JI, Yun Je
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a printed circuit board. The printed circuit board includes: a plurality of insulating layers; a plurality of circuit layers disposed on at least one of an interior and an exterior of the plurality of insulating layers; and a reinforcing layer disposed on one surface of the plurality of insulating layers, and having a first opening having a first width and a second opening having a second width, different from the first width.