COOLING MODULE COMPRISING A COOLING STRUCTURE FOR DISSIPATION OF HEAT

The invention concerns an alveolar cooling structure (3) which is configured to dissipate the heat generated by at least one electronic component (40) placed on an upper surface (21) of a substrate (2), the alveolar cooling structure (3) being in contact with an inner surface (22) of the said substr...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Verhoog, Roelof
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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