COOLING MODULE COMPRISING A COOLING STRUCTURE FOR DISSIPATION OF HEAT

COOLING MODULE COMPRISING A COOLING STRUCTURE FOR DISSIPATION OF HEAT

The invention concerns an alveolar cooling structure (3) which is configured to dissipate the heat generated by at least one electronic component (40) placed on an upper surface (21) of a substrate (2), the alveolar cooling structure (3) being in contact with an inner surface (22) of the said substr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Verhoog, Roelof
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The invention concerns an alveolar cooling structure (3) which is configured to dissipate the heat generated by at least one electronic component (40) placed on an upper surface (21) of a substrate (2), the alveolar cooling structure (3) being in contact with an inner surface (22) of the said substrate (2). The alveolar cooling structure (3) comprises cells, the cell edges of which increase a total contact surface between the alveolar cooling structure (3) and a cooling fluid; and pores which are defined by the cells and distributed in the volume of the alveolar cooling structure (3), the cooling fluid circulating through the pores and/or through the spaces between the pores.