HIGH-PERFORMANCE COMPUTING COOLING SYSTEM

A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generat...

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Bibliographische Detailangaben
Hauptverfasser:	Pescetto, Michael James, North, Travis C, Grossmann, Philip Joseph, Vick, Jacob
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING CONTROL OR REGULATING SYSTEMS IN GENERAL CONTROLLING COUNTING ELECTRIC DIGITAL DATA PROCESSING FUNCTIONAL ELEMENTS OF SUCH SYSTEMS MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS PHYSICS REGULATING
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Beschreibung
Zusammenfassung:	A computing cooling system includes a chassis, heat dissipation device(s) in the chassis, a first fan system in the chassis configured to generate a first airflow that is directed past the heat dissipation device(s) and out of the chassis, and a second fan system in the chassis configured to generate a second airflow that is that is directed into the chassis. A board in the chassis includes a first board section located adjacent the first fan system, and a second board section located adjacent the second fan system and configured to receive the second airflow. The first board section includes first components that are thermally coupled to the heat dissipation device(s) and that are configured to operate in a first temperature range, and the second board section includes second components that are configured to operate in a second temperature range that is lower than the first temperature range.