CHEMICAL MECHANICAL POLISHING COMPOSITION AND METHOD

Chemical mechanical polishing compositions include modified silanized colloidal silica particles which are reaction products of silanized colloidal silica particles having epoxy moieties with nitrogen of amines to form stable and tunable modified silanized colloidal silica particles. The modified si...

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Bibliographische Detailangaben
Hauptverfasser:	Tettey, Kwadwo, Van Hanehem, Matthew Richard, Theivanayagam, Murali Ganth, Zhang, Li, Mosley, David Wayne, Chi, Changzai
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Chemical mechanical polishing compositions include modified silanized colloidal silica particles which are reaction products of silanized colloidal silica particles having epoxy moieties with nitrogen of amines to form stable and tunable modified silanized colloidal silica particles. The modified silanized colloidal silica particles can be used as an abrasive in chemical mechanical polishing of various substrates to polish metal such as copper, Ta and TaN and dielectrics such as TEOS and low-K film.