ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES
Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic...
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creator | ESQUIUS MOROTE, Marc GIESEN, Marcel LUKASHOV, Ilya FREISLEBEN, Stefan TELGMANN, Thomas POHLNER, Stephan JUNGKUNZ, Matthias EGGS, Christoph |
description | Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022345828A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022345828A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022345828A13</originalsourceid><addsrcrecordid>eNrjZAhyDXH2UAgO8Q9QcPRzUQgI8g9xdQ7x9PdT8HGMdA1ScPMPUnB2DHB09gwBsoDSzq7BwZ5-7gqefgquPkClQf6Ozv6hwSGezgourmGeQGkeBta0xJziVF4ozc2g7AayRTe1ID8-tbggMTk1L7UkPjTYyMDIyNjE1MLIwtHQmDhVAJvgMLM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES</title><source>esp@cenet</source><creator>ESQUIUS MOROTE, Marc ; GIESEN, Marcel ; LUKASHOV, Ilya ; FREISLEBEN, Stefan ; TELGMANN, Thomas ; POHLNER, Stephan ; JUNGKUNZ, Matthias ; EGGS, Christoph</creator><creatorcontrib>ESQUIUS MOROTE, Marc ; GIESEN, Marcel ; LUKASHOV, Ilya ; FREISLEBEN, Stefan ; TELGMANN, Thomas ; POHLNER, Stephan ; JUNGKUNZ, Matthias ; EGGS, Christoph</creatorcontrib><description>Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.</description><language>eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221027&DB=EPODOC&CC=US&NR=2022345828A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20221027&DB=EPODOC&CC=US&NR=2022345828A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ESQUIUS MOROTE, Marc</creatorcontrib><creatorcontrib>GIESEN, Marcel</creatorcontrib><creatorcontrib>LUKASHOV, Ilya</creatorcontrib><creatorcontrib>FREISLEBEN, Stefan</creatorcontrib><creatorcontrib>TELGMANN, Thomas</creatorcontrib><creatorcontrib>POHLNER, Stephan</creatorcontrib><creatorcontrib>JUNGKUNZ, Matthias</creatorcontrib><creatorcontrib>EGGS, Christoph</creatorcontrib><title>ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES</title><description>Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAhyDXH2UAgO8Q9QcPRzUQgI8g9xdQ7x9PdT8HGMdA1ScPMPUnB2DHB09gwBsoDSzq7BwZ5-7gqefgquPkClQf6Ozv6hwSGezgourmGeQGkeBta0xJziVF4ozc2g7AayRTe1ID8-tbggMTk1L7UkPjTYyMDIyNjE1MLIwtHQmDhVAJvgMLM</recordid><startdate>20221027</startdate><enddate>20221027</enddate><creator>ESQUIUS MOROTE, Marc</creator><creator>GIESEN, Marcel</creator><creator>LUKASHOV, Ilya</creator><creator>FREISLEBEN, Stefan</creator><creator>TELGMANN, Thomas</creator><creator>POHLNER, Stephan</creator><creator>JUNGKUNZ, Matthias</creator><creator>EGGS, Christoph</creator><scope>EVB</scope></search><sort><creationdate>20221027</creationdate><title>ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES</title><author>ESQUIUS MOROTE, Marc ; GIESEN, Marcel ; LUKASHOV, Ilya ; FREISLEBEN, Stefan ; TELGMANN, Thomas ; POHLNER, Stephan ; JUNGKUNZ, Matthias ; EGGS, Christoph</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022345828A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>ESQUIUS MOROTE, Marc</creatorcontrib><creatorcontrib>GIESEN, Marcel</creatorcontrib><creatorcontrib>LUKASHOV, Ilya</creatorcontrib><creatorcontrib>FREISLEBEN, Stefan</creatorcontrib><creatorcontrib>TELGMANN, Thomas</creatorcontrib><creatorcontrib>POHLNER, Stephan</creatorcontrib><creatorcontrib>JUNGKUNZ, Matthias</creatorcontrib><creatorcontrib>EGGS, Christoph</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ESQUIUS MOROTE, Marc</au><au>GIESEN, Marcel</au><au>LUKASHOV, Ilya</au><au>FREISLEBEN, Stefan</au><au>TELGMANN, Thomas</au><au>POHLNER, Stephan</au><au>JUNGKUNZ, Matthias</au><au>EGGS, Christoph</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES</title><date>2022-10-27</date><risdate>2022</risdate><abstract>Electroacoustic devices with a capacitive element and methods for fabricating such electroacoustic devices. An example method includes forming an acoustic device above a first region of a substrate, and forming a capacitive element above a second region of the substrate and adjacent to the acoustic device. The forming of the capacitive element may include forming a protective layer above the substrate where a first portion of the protective layer is above the second region of the substrate and a second portion of the protective layer is above the first region of the substrate, forming a dielectric region above the protective layer, and forming an electrode above the dielectric region. The dielectric region may include a different material than the protective layer.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
title | ETCH STOP AND PROTECTION LAYER FOR CAPACITOR PROCESSING IN ELECTROACOUSTIC DEVICES |
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