REACTIVE ADHESIVE FILM WITH GOOD HEAT-AND-HUMIDITY RESISTANCE, IN PARTICULAR FOR BONDING POLYAMIDE

Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MOEHRKE, Claudia, CROUZY, Séverine, LUNDING, Marta, ZEYSING, Björn, SCHÜMANN, Uwe
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Reactive adhesive film for bonding various materials, including plastic to metal, the adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one epoxide-functionalized (meth)acrylate or vinyl monomer and (c) a reagent selected from an initiator, in particular a free-radical initiator, or an activator. Further disclosed are reactive adhesive film systems comprising two reactive adhesive films. Methods for producing reactive adhesive films, and methods are also disclosed.