DEVICE WITH MULTI-CHANNEL BONDING
A system may include primary and secondary integrated circuits. The primary integrated circuit may receive a first subset of data packets associated with a first set of sequence numbers. The secondary integrated circuit may receive a second subset of data packets associated with a second set of sequ...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A system may include primary and secondary integrated circuits. The primary integrated circuit may receive a first subset of data packets associated with a first set of sequence numbers. The secondary integrated circuit may receive a second subset of data packets associated with a second set of sequence numbers. The primary integrated circuit is configured to manage the first set of sequence numbers and the second set of sequence numbers on behalf of the secondary integrated circuit and for the system. |
---|