GRID-BASED INTERCONNECT SYSTEM FOR MODULAR INTEGRATED CIRCUIT SYSTEMS

GRID-BASED INTERCONNECT SYSTEM FOR MODULAR INTEGRATED CIRCUIT SYSTEMS

Systems and methods are provided for a modular die-to-die interconnect for integrated circuits in a three-dimensional arrangement. An integrated circuit system may include a first chiplet that includes a grid-based interconnect field and a second chiplet that includes a complementary grid-based inte...

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Bibliographische Detailangaben
Hauptverfasser: Nalamalpu, Ankireddy, Kumashikar, Mahesh K, Maheshwari, Atul, Tang, Lai Guan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Systems and methods are provided for a modular die-to-die interconnect for integrated circuits in a three-dimensional arrangement. An integrated circuit system may include a first chiplet that includes a grid-based interconnect field and a second chiplet that includes a complementary grid-based interconnect field. A number of interconnects of the complementary grid-based interconnect field of the second chiplet are connected to a corresponding number of interconnects of the grid-based interconnect field of the first chiplet.