WAFER CHUCK FOR HANDLING A WAFER

The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LOWACK, Mario, HOFFROGGE, Peter
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The invention relates to a wafer chuck for handling a wafer, in particular in a wafer process device, further preferably in a scanning acoustic microscope, with a fixing device for the wafer, wherein the fixing device has a free space for receiving the wafer and a holder with multiple wafer contact fingers, which are movable relative to the holder for a wafer. The wafer contact fingers are arranged annularly around the free space for the wafer, preferably in one plane. The wafer contact fingers can be moved in the direction of the free space for the wafer or can be moved away from the free space for the wafer. One actuation device for the wafer contact fingers is provided and, when the actuation device is actuated, the wafer contact fingers are moved or can be moved simultaneously.