SEMICONDUCTOR DEVICE PACKAGE, ANTENNA DEVICE, AND METHOD FOR MANUFACTURING THE SAME

A semiconductor device package and method for manufacturing the same are provided. The semiconductor device package includes a dielectric layer, an electronic component, a first conductive layer, and a conductive element. The dielectric layer has a first surface and a second surface opposite to the first surface. The electronic component is embedded in the dielectric layer. The first conductive layer is embedded in the dielectric layer and adjacent to the first surface of the dielectric layer. The conductive element is disposed on the first surface of the dielectric layer and in contact with the first conductive layer.