SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME

SUSPENSION FOR CHEMICAL MECHANICAL PLANARIZATION (CMP) AND METHOD EMPLOYING THE SAME

The present disclosure relates to aqueous suspensions suitable for chemical mechanical planarization (CMP), the use of aqueous suspensions and a method of CMP using aqueous suspensions. The suspensions and method can be used for CMP of silicon carbide surfaces.

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Bibliographische Detailangaben
Hauptverfasser: MAHADEV, Niraj, CYFFKA, Mark, ALETY, Sridevi R
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
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Beschreibung
Zusammenfassung:The present disclosure relates to aqueous suspensions suitable for chemical mechanical planarization (CMP), the use of aqueous suspensions and a method of CMP using aqueous suspensions. The suspensions and method can be used for CMP of silicon carbide surfaces.