PACKAGE EXPANDED BEAM CONNECTOR FOR ON-PACKAGE OPTICS

Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and...

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Bibliographische Detailangaben
Hauptverfasser: MORGAN, Wesley, DESHPANDE, Nitin, PRATAP, Divya, COONS, Todd R, LI, Xiaoqian, MURTAGIAN, Gregorio R, NEKKANTY, Srikant
Format: Patent
Sprache:eng
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Zusammenfassung:Embodiments disclosed herein include photonics packages and systems. In an embodiment, a photonics package comprises a package substrate, where the package substrate comprises a cutout along an edge of the package substrate. In an embodiment, a photonics die is coupled to the package substrate, and the photonics die is positioned adjacent to the cutout. In an embodiment, the photonics package further comprises a receptacle for receiving a pluggable optical connector. In an embodiment, the receptacle is over the cutout.