SUBSTRATES FOR ELECTRONIC SKINS

A substrate for use in an electronic skin is disclosed herein. The substrate comprises a base polymer layer, and a first intermediate polymer layer attached to the base polymer layer by a first adhesive layer. The first intermediate polymer layer comprises a first intermediate polymer in which elect...

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Bibliographische Detailangaben
Hauptverfasser:	MASTROPAOLO, Enrico, BECKWITH, Mark James, SYED, Atif
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPARATUS SPECIALLY ADAPTED THEREFOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON DIAGNOSIS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY GENERAL PROCESSES OF COMPOUNDING HOLOGRAPHY HUMAN NECESSITIES HYGIENE IDENTIFICATION MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS MEDICAL OR VETERINARY SCIENCE METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURGERY TESTING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A substrate for use in an electronic skin is disclosed herein. The substrate comprises a base polymer layer, and a first intermediate polymer layer attached to the base polymer layer by a first adhesive layer. The first intermediate polymer layer comprises a first intermediate polymer in which electron-rich groups are linked directly to one another or by optionally substituted C1-4 alkanediyl groups. A first conductive layer is attached to the first intermediate polymer layer by a second adhesive layer or by multiple second adhesive layers between which a second intermediate polymer layer or a second conductive layer is disposed.