MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE DEVICE STACKS AND RELATED METHODS

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE DEVICE STACKS AND RELATED METHODS

Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stack...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lim, Dong Soon, Limaye, Aparna U, Fay, Owen R, Richards, Randon K
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.