SEMICONDUCTOR DEVICE

A semiconductor device includes: a semiconductor element having an element main surface and an element back surface spaced apart from each other in a thickness direction, and including a plurality of main surface electrodes arranged on the element main surface; a die pad on which the semiconductor element is mounted; a plurality of leads including at least one first lead arranged on one side in a first direction orthogonal to the thickness direction with respect to the die pad, and arranged around the die pad when viewed in the thickness direction; a plurality of connecting members including a first connecting member, and configured to electrically connect the plurality of main surface electrodes and the plurality of leads; and a resin member configured to seal the semiconductor element, a part of the die pad, parts of the plurality of leads, and the plurality of connecting members.