METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM

There is provided a technique that includes: (a) forming a first film in an amorphous state on the substrate by supplying a first process gas to the substrate; (b) forming a second film in an amorphous state, which has a crystallization temperature lower than a crystallization temperature of the fir...

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Bibliographische Detailangaben
Hauptverfasser: TAKAHASHI, Masahiro, HORITA, Hideki
Format: Patent
Sprache:eng
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Zusammenfassung:There is provided a technique that includes: (a) forming a first film in an amorphous state on the substrate by supplying a first process gas to the substrate; (b) forming a second film in an amorphous state, which has a crystallization temperature lower than a crystallization temperature of the first film, on the first film by supplying a second process gas to the substrate; (c) crystallizing the first film and the second film formed on the substrate by heating the first film and the second film; and (d) removing at least the second film by exposing a surface of the substrate to an etching agent after crystallizing the first film and the second film.