Electro-optical device via arrangement
According to an example aspect of the present invention, there is provided an electro-optical device, comprising: a planar first substrate, a first electric contact point on a first side of the first substrate, a second electric contact point on a second side of the first substrate, and a via arrang...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | According to an example aspect of the present invention, there is provided an electro-optical device, comprising: a planar first substrate, a first electric contact point on a first side of the first substrate, a second electric contact point on a second side of the first substrate, and a via arrangement configured to provide electric contact between the first electric contact point and the second electric contact point. The via arrangement comprises a fiber optic portion and an electrically conductive portion, wherein the electrically conductive portion is arranged between the fiber optic portion and the first substrate and is configured to electrically connect the first electric contact point and the second electric contact point. |
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