METHOD FOR OPTIMIZED FILLING HOLE AND MANUFACTURING FINE LINE ON PRINTED CIRCUIT BOARD

A method for optimized filling holes and manufacturing fine lines on a printed circuit board (PCB) carries out the two processes separately. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. The processes are individually p...

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Bibliographische Detailangaben
Hauptverfasser:	Yeh, Albert, Yang, Nick
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A method for optimized filling holes and manufacturing fine lines on a printed circuit board (PCB) carries out the two processes separately. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. The processes are individually performed and thus operating parameters are considered independently. As a result, the copper-plating fillings are evenly compact and the fine lines have square profiles.