ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE PILLAR

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE PILLAR

An electrically conductive pillar that can bond a base member and a member to be bonded together with high bonding strength with a bonding layer interposed therebetween and a method for manufacturing the same. Specifically, an electrically conductive pillar 1 is composed of a sintered body 12 of met...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMAGUCHI, Ryota, YADA, Makoto
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electrically conductive pillar that can bond a base member and a member to be bonded together with high bonding strength with a bonding layer interposed therebetween and a method for manufacturing the same. Specifically, an electrically conductive pillar 1 is composed of a sintered body 12 of metal micro-particles disposed on a base member 11. The average particle size of the metal micro-particles is less than 1 μm as measured using a small-angle X-ray scattering method. An upper surface 12b of the sintered body 12 has a concave shape recessed on the base member 11 side. The metal micro-particles are preferably made of one or more metals selected from Ag and Cu.