SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

A semiconductor manufacturing apparatus includes a transfer device that includes a transfer blade whose mounting area on which a wafer is mounted is defined on a front surface and a transfer arm adjusting a position of the transfer blade, and a processing chamber that accommodates the transfer blade...

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Bibliographische Detailangaben
1. Verfasser: KAWASAKI, Daichi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor manufacturing apparatus includes a transfer device that includes a transfer blade whose mounting area on which a wafer is mounted is defined on a front surface and a transfer arm adjusting a position of the transfer blade, and a processing chamber that accommodates the transfer blade and is for removing foreign matter adhering to the mounting area.