SUBSTRATE PROCESSING APPARATUS

Disclosed herein is a substrate processing apparatus capable of adjusting positions of first and second electrodes in advance in consideration of the difference in thermal expansion in order to prevent a short-circuit from occurring due to the contact between the first and second electrodes even if...

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Bibliographische Detailangaben
Hauptverfasser: OH, Woong Kyo, YOO, Kwang Su, KIM, Do Hyung, HA, Yun Gyu, KIM, Young Woon
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed herein is a substrate processing apparatus capable of adjusting positions of first and second electrodes in advance in consideration of the difference in thermal expansion in order to prevent a short-circuit from occurring due to the contact between the first and second electrodes even if the first and second electrodes are thermally expanded during the process. The substrate processing apparatus is advantageous in that it can prevent the short-circuit between the first and second electrodes even if the first and second electrodes are thermally expanded due to the increase in temperature during the process and can maintain the uniformity of a thin film in the large-area substrate processing apparatus.