DEEP REACTIVE ION ETCHING PROCESS FOR FLUID EJECTION HEADS

DEEP REACTIVE ION ETCHING PROCESS FOR FLUID EJECTION HEADS

An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one me...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: BERNARD, David L
Format: Patent
Sprache:eng
Schlagworte:
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PRINTING
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Beschreibung
Zusammenfassung:An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.