3D PRINTING OF FULLY DENSE AND CRACK FREE SILICON WITH SELECTIVE LASER MELTING/SINTERING AT ELEVATED TEMPERATURES

In a fully dense printing method, a plurality of buffer layers of silicon are initially printed on a steel substrate, and then layers of silicon for the actual component are printed on top of the buffer layers using a double printing method. In a fully dense and crack free printing method, one or mo...

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Bibliographische Detailangaben
Hauptverfasser:	SONG, Yi, NITHIANANTHAN, Vijay, CHEN, Jihong
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING PERFORMING OPERATIONS SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG, OR MIXTURESCONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER TRANSPORTING WORKING CEMENT, CLAY, OR STONE
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Beschreibung
Zusammenfassung:	In a fully dense printing method, a plurality of buffer layers of silicon are initially printed on a steel substrate, and then layers of silicon for the actual component are printed on top of the buffer layers using a double printing method. In a fully dense and crack free printing method, one or more heaters and thermal insulation are used to minimize temperature gradient during Si printing, in-situ annealing, and cooling.