SINGLE-TURN AND LAMINATED-WALL INDUCTIVELY COUPLED PLASMA SOURCES

This disclosure describes systems, methods, and apparatus for making and using a single-turn coil on a remote plasma source to reduce capacitive coupling between the coil and a plasma, and/or a laminated chamber wall including at least one conductive layer that reduces capacitive coupling between the coil and the plasma. Where a laminated chamber wall is used, the coil can either be a single or multi-turn coil. Additive processes can be used to fuse or bond the conductive layer(s) to lower layers (e.g., dielectric layers) as well as to fuse or bond a final layer (e.g., dielectric) to an outermost conductive layer. Further, a method is disclosed wherein a conductive layer within the lamination is biased during plasma ignition and then the bias is reduced after ignition.