SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

An object is to provide a technique capable of suppressing an occurrence of a non-filled portion. A semiconductor device includes a base plate, a case, and a semiconductor element. The semiconductor element is disposed in a space of the base plate and the case. The semiconductor device includes a le...

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Bibliographische Detailangaben
Hauptverfasser:	Kondo, Satoshi, Fujino, Junji, Noda, Kazuma, Ogawa, Michio
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An object is to provide a technique capable of suppressing an occurrence of a non-filled portion. A semiconductor device includes a base plate, a case, and a semiconductor element. The semiconductor element is disposed in a space of the base plate and the case. The semiconductor device includes a lead electrode. The lead electrode is connected to an upper surface of the semiconductor element in the space. The semiconductor device includes a raised portion. The raised portion is disposed on an upper surface of the lead electrode in the space. The semiconductor device includes a sealing resin. The sealing resin seals the semiconductor element and the lead electrode in the space.