FIELD PLATE STRUCTURE FOR HIGH VOLTAGE DEVICE

Various embodiments of the present disclosure are directed towards an integrated chip comprising a gate electrode disposed on a substrate between a pair of source/drain regions. A dielectric layer is over the substrate. A field plate is disposed on the dielectric layer and laterally between the gate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lu, Hui-Ting, Ho, Chia-Cheng, Jong, Yu-Chang, Wang, Pei-Lun, Jhou, Jyun-Guan
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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