RESIN COMPOSITION FOR ENCAPSULATING LIGHT-EMITTING DEVICE, LIGHT SOURCE UNIT, AND METHOD FOR MANUFACTURING LIGHT SOURCE UNIT

The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied:(i...

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Bibliographische Detailangaben
Hauptverfasser:	Sugimoto, Naoya, Kawamitsu, Shoichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a resin composition for producing an encapsulating member having high heat resistance and high encapsulation performance. In the resin composition for encapsulating a light-emitting device according to the present invention, at least one of (i) and (ii) is satisfied:(i) the resin composition includes a polymer (P1) including: a structural unit (A) represented by the following formula (1); and a structural unit (B) having at least one functional group selected from the group consisting of a carbonyl-containing group, a hydroxyl group, an epoxy group, an isocyanate group, and a cyano group; and(ii) the resin composition includes: a polymer (P2) including the structural unit (A); and a polymer (P3) including the structural unit (B).