METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM

According to one aspect of a technique the present disclosure, there is provided a method of manufacturing a semiconductor device, including: (a) processing a substrate accommodated in a process chamber by supplying a process gas to the substrate; and (b) removing deposits adhering to a structure in...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIMIZU, Hideto, NISHIURA, Susumu, INOSHIMA, Kaori
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:According to one aspect of a technique the present disclosure, there is provided a method of manufacturing a semiconductor device, including: (a) processing a substrate accommodated in a process chamber by supplying a process gas to the substrate; and (b) removing deposits adhering to a structure in the process chamber by supplying a cleaning gas to the process chamber, wherein a period T2 from a completion of (b) to a start of an (n+1)th execution of (a) is set to be shorter than a period T1 from a completion of an nth execution of (a) to a start of (b), and wherein n is an integer equal to or greater than 1.