HEAT REMOVAL INFRASTRUCTURES FOR ENDOSCOPES

Disclosed herein is an elongated shaft for a multi-camera endoscope. The shaft includes (i) a circuit board assembly (CBA) including at least a front camera and two opposite-facing side-cameras; (ii) a heat sink structure located at a distal section of the shaft; (iii) an illumination unit(s) mounte...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AIZENFELD, Amram, SALMAN, Golan
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed herein is an elongated shaft for a multi-camera endoscope. The shaft includes (i) a circuit board assembly (CBA) including at least a front camera and two opposite-facing side-cameras; (ii) a heat sink structure located at a distal section of the shaft; (iii) an illumination unit(s) mounted on the heat sink structure and configured to illuminate a field-of-view of the cameras; and (iv) at least one conduit configured for heat conveyance, extending proximally along the shaft from the heat sink structure, via which the at least one conduit is thermally coupled to the illumination unit(s). The heat sink structure is essentially cylindrical and includes (i) at least two complementary parts forming a compartment therebetween that accommodates the distal section of the CBA, and (ii) holes where through lens assemblies of the cameras are fitted such as to secure the distal section of the CBA within the compartment.