SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor package includes an interconnect structure, an insulating layer and a conductive layer. The interconnect structure includes a first surface and a second surface opposite to the first surface. The insulating layer contacts the interconnect structure. The insulating layer includes a th...

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Bibliographische Detailangaben
Hauptverfasser:	WANG, CHUEI-TANG, LIAO, YU-KUANG, CHANG, CHIH-YUAN, CHANG, CHIHIEH, HSIEH, JENG-SHIEN, HSIA, HSING-KUO, YU, CHEN-HUA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor package includes an interconnect structure, an insulating layer and a conductive layer. The interconnect structure includes a first surface and a second surface opposite to the first surface. The insulating layer contacts the interconnect structure. The insulating layer includes a third surface contacting the second surface of the interconnect structure and a fourth surface opposite to the third surface. The conductive layer is electrically coupled to the interconnect structure. The conductive layer has a continuous portion extending from the second surface to the fourth surface.