MAGNETIC FIELD SENSOR PACKAGE
A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the fron...
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| creator | Schmitt, Jochen O'Mara, Brian Cusack, Michael J Nicholl, Enda Joseph |
| description | A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet. |
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The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.</description><language>eng</language><subject>ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE ; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR ; PHYSICS ; TARIFF METERING APPARATUS ; TESTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220811&DB=EPODOC&CC=US&NR=2022252427A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220811&DB=EPODOC&CC=US&NR=2022252427A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Schmitt, Jochen</creatorcontrib><creatorcontrib>O'Mara, Brian</creatorcontrib><creatorcontrib>Cusack, Michael J</creatorcontrib><creatorcontrib>Nicholl, Enda Joseph</creatorcontrib><title>MAGNETIC FIELD SENSOR PACKAGE</title><description>A magnetic field sensor package is disclosed. 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The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING |
| title | MAGNETIC FIELD SENSOR PACKAGE |
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