MAGNETIC FIELD SENSOR PACKAGE

A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the fron...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Schmitt, Jochen, O'Mara, Brian, Cusack, Michael J, Nicholl, Enda Joseph
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR PHYSICS TARIFF METERING APPARATUS TESTING
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Beschreibung
Zusammenfassung:	A magnetic field sensor package is disclosed. The package includes a substrate that has a front side and a back side opposite the front side. The substrate can comprise a lead frame. The package also includes a first magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package also includes a second magnetic field sensor die that is electrically and mechanically mounted on the front side of the substrate. The package further includes a magnet that is disposed on the back side of the substrate. The magnet can provide a bias field for the first magnetic field sensor die and the second magnetic field sensor die. The package can also include a molding material that is disposed about the lead frame, the first magnetic field sensor die, the second magnetic field sensor die, and the magnet.