RESIN COMPOSITION FOR 3D PRINTING

A radiation-curable resin composition, comprisingfrom 0 to 30% by weight of one or more oligomers;from 15 to 80% by weight of one or more monomers;from 10 to 80% by weight of a filler mixture;from 0.1 to 5% by weight of one or more photoinitiators;wherein the filler mixture includes:from 39.9 to 90%...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KRUBER, Dirk, SZILLUWEIT, Robert, ZILLES, Jörg Ulrich, MÜHLING, Olaf
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A radiation-curable resin composition, comprisingfrom 0 to 30% by weight of one or more oligomers;from 15 to 80% by weight of one or more monomers;from 10 to 80% by weight of a filler mixture;from 0.1 to 5% by weight of one or more photoinitiators;wherein the filler mixture includes:from 39.9 to 90% by weight of first particles having a grain size d50vol of 3 to 20 μm;from 9.9 to 60% by weight of second particles having a grain size d50vol of 0.5 to 1 μm;from 0.1 to 5% by weight of nanoparticles having a BET surface area within a range of from 10 to 100 m2/g.