PROCESSING APPARATUS AND PROCESSING METHOD

A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a holder moving mechanism configured to move the holder in a horizontal direction; a modifying device configured to radiate laser light to an inside of the proce...

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Hauptverfasser: YAMASHITA, Yohei, MORI, Hirotoshi, TANOUE, Hayato, YAMAWAKI, Yohei
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Sprache:eng
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creator YAMASHITA, Yohei
MORI, Hirotoshi
TANOUE, Hayato
YAMAWAKI, Yohei
description A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a holder moving mechanism configured to move the holder in a horizontal direction; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers in a spiral shape; a modifying device moving mechanism configured to move the modifying device in the horizontal direction; and a controller configured to control an operation of forming the internal modification layers. The controller controls operations of the holder and the modifying device such that a spiral processing movement according to the formation of the internal modification layers and an eccentricity follow-up movement of correcting an eccentric amount between the holder and the processing target object held by the holder are shared by the holder and the modifying device.
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recordid cdi_epo_espacenet_US2022250190A1
source esp@cenet
subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title PROCESSING APPARATUS AND PROCESSING METHOD
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