SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE

Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	VADHAVKAR, Sameer Sunil, YUN, Changhan Hobie, THADESAR, Paragkumar Ajaybhai, PARK, Nosun, KIM, Daniel Daeik
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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