SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE

SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE

Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: VADHAVKAR, Sameer Sunil, YUN, Changhan Hobie, THADESAR, Paragkumar Ajaybhai, PARK, Nosun, KIM, Daniel Daeik
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom surface of the circuit board, the one or more first connector contacts being configured to electrically couple the circuit board to a connector receptacle.