SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE

Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: VADHAVKAR, Sameer Sunil, YUN, Changhan Hobie, THADESAR, Paragkumar Ajaybhai, PARK, Nosun, KIM, Daniel Daeik
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator VADHAVKAR, Sameer Sunil
YUN, Changhan Hobie
THADESAR, Paragkumar Ajaybhai
PARK, Nosun
KIM, Daniel Daeik
description Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom surface of the circuit board, the one or more first connector contacts being configured to electrically couple the circuit board to a connector receptacle.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022248541A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022248541A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022248541A13</originalsourceid><addsrcrecordid>eNrjZDAKjgwOcfVV8PRTCHB09nZ0d1XQCPYM0FQI9nf2dg1RcPb383N1DvEPAqoIcQ1yc3R25WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGRkYmFqYmho6GxsSpAgDv9Cdz</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE</title><source>esp@cenet</source><creator>VADHAVKAR, Sameer Sunil ; YUN, Changhan Hobie ; THADESAR, Paragkumar Ajaybhai ; PARK, Nosun ; KIM, Daniel Daeik</creator><creatorcontrib>VADHAVKAR, Sameer Sunil ; YUN, Changhan Hobie ; THADESAR, Paragkumar Ajaybhai ; PARK, Nosun ; KIM, Daniel Daeik</creatorcontrib><description>Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom surface of the circuit board, the one or more first connector contacts being configured to electrically couple the circuit board to a connector receptacle.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CURRENT COLLECTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220804&amp;DB=EPODOC&amp;CC=US&amp;NR=2022248541A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220804&amp;DB=EPODOC&amp;CC=US&amp;NR=2022248541A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>VADHAVKAR, Sameer Sunil</creatorcontrib><creatorcontrib>YUN, Changhan Hobie</creatorcontrib><creatorcontrib>THADESAR, Paragkumar Ajaybhai</creatorcontrib><creatorcontrib>PARK, Nosun</creatorcontrib><creatorcontrib>KIM, Daniel Daeik</creatorcontrib><title>SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE</title><description>Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom surface of the circuit board, the one or more first connector contacts being configured to electrically couple the circuit board to a connector receptacle.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAKjgwOcfVV8PRTCHB09nZ0d1XQCPYM0FQI9nf2dg1RcPb383N1DvEPAqoIcQ1yc3R25WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGRkYmFqYmho6GxsSpAgDv9Cdz</recordid><startdate>20220804</startdate><enddate>20220804</enddate><creator>VADHAVKAR, Sameer Sunil</creator><creator>YUN, Changhan Hobie</creator><creator>THADESAR, Paragkumar Ajaybhai</creator><creator>PARK, Nosun</creator><creator>KIM, Daniel Daeik</creator><scope>EVB</scope></search><sort><creationdate>20220804</creationdate><title>SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE</title><author>VADHAVKAR, Sameer Sunil ; YUN, Changhan Hobie ; THADESAR, Paragkumar Ajaybhai ; PARK, Nosun ; KIM, Daniel Daeik</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022248541A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>VADHAVKAR, Sameer Sunil</creatorcontrib><creatorcontrib>YUN, Changhan Hobie</creatorcontrib><creatorcontrib>THADESAR, Paragkumar Ajaybhai</creatorcontrib><creatorcontrib>PARK, Nosun</creatorcontrib><creatorcontrib>KIM, Daniel Daeik</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>VADHAVKAR, Sameer Sunil</au><au>YUN, Changhan Hobie</au><au>THADESAR, Paragkumar Ajaybhai</au><au>PARK, Nosun</au><au>KIM, Daniel Daeik</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE</title><date>2022-08-04</date><risdate>2022</risdate><abstract>Certain aspects of the present disclosure generally relate to an electronic device. One example electronic device generally includes a SIP module having a circuit board and one or more electronic elements disposed above the circuit board, and one or more first connector contacts coupled to a bottom surface of the circuit board, the one or more first connector contacts being configured to electrically couple the circuit board to a connector receptacle.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2022248541A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CURRENT COLLECTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title SYSTEM IN PACKAGE (SIP) SOCKET CONNECTOR INTERFACE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-15T06%3A42%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=VADHAVKAR,%20Sameer%20Sunil&rft.date=2022-08-04&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022248541A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true