PACKAGING STRUCTURE AND FORMATION METHOD THEREOF

Packaging structure and formation method are provided. The packaging structure includes a pre-encapsulation panel, which includes an encapsulation layer containing a plurality of semiconductor chips. Each semiconductor chip includes a functional surface and a non-functional surface opposite to the functional surface. A plurality of pads are formed on the functional surface, and the encapsulation layer exposes the plurality of pads. The packaging structure also includes a first shielding layer and a second shielding layer disposed between a semiconductor chip and the encapsulation layer. The first shielding layer covers the non-functional surface and a sidewall surface of the semiconductor chip. The second shielding layer is disposed between the first shielding layer and the encapsulation layer and fully covers a surface of the first shielding layer. Further, the packaging structure includes an external contact structure disposed on a back side of the pre-encapsulation panel and connected to a pad.