JUNCTION STRUCTURE, METHOD FOR MANUFACTURING JUNCTION STRUCTURE, AND SOLDER BALL

Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au-Sn-based alloy, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.

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Bibliographische Detailangaben
Hauptverfasser:	AKASHI, Keisuke, TANAKA, Masamoto, KOMORI, Kiyotsugu, HOSHINO, Katsuhiko, YAMAZAKI, Tsunekazu, KOBAYASHI, Takayuki, YAMAMOTO, Sukeyoshi, MISAWA, Kensuke
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Provided is a joint structure. The joint structure includes a first structure, and a second structure joined to the first structure via a joint portion formed of a Au-Sn-based alloy, wherein a thickness of the joint portion is 3 μm or more and 50 μm or less.